New and innovative 3D-AOI from GOEPEL electronic
This webinar recording discusses the latest developments in the field of 3D AOI measurement of components and solder joints of printed board assemblies. The webinar demonstrates how current procedures and technologies are suitable for use in solder paste inspection, but not completely adequate for inspection of printed circuit board assemblies. In particular, the shadow effects of high components and the high density of assemblies limit the use of the well-known triangulation technology for this application.
This webinar recording discusses the use of a combined X-ray and AOI approach for IPC compliant inspection of solder joints on electronic assemblies. The webinar shows why X-ray inspection should be used for testing of all solder joints of an assembly, and not only for partially concealed solder joints. Furthermore, possibilities and limits of error detection will be shown by many image examples.
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The following video demonstrates the image acquisition in a GOEPEL Opticon THT Line automated inspection system:
To learn more about GOEPEL’s AOI systems, including the THT Line, visit us online at www.goepelusa.com.
Seek and you shall find – An article published in the March 2013 issue of the Global SMT & Packaging magazine, GOEPEL’s Patrick Schuchardt discusses various considerations that play a role in choosing the right optical inspection systems for ones specific needs and requirements. Read the rest of this entry