This webinar recording discusses the use of a combined X-ray and AOI approach for IPC compliant inspection of solder joints on electronic assemblies. The webinar shows why X-ray inspection should be used for testing of all solder joints of an assembly, and not only for partially concealed solder joints. Furthermore, possibilities and limits of error detection will be shown by many image examples.
As an essential component of the latest version v3.1 of its X-ray inspection software XI-Pilot, GOEPEL introduces a new module for easier evaluation of x-ray images. The innovative new feature, topoVIEW™, facilitates the interpretation of recorded x-ray images with respect to better fault assessment and classification. Read the rest of this entry
An article titled “3D X-Ray Inspection Provides Quality Check of Double-Sided PCBs” by GOEPEL’s Andreas Tuerk, published in he March 2013 issue of US Tech, briefly explains how 3D X-Ray Inspection enables superior quality checks of double-sided printed circuit board assemblies (PCBAs).
Specific topics discussed in the article include digital tomosynthesis, component libraries, and PCB warping.