3D AOI without compromises

New and innovative 3D-AOI from GOEPEL electronic

This webinar recording discusses the latest developments in the field of 3D AOI measurement of components and solder joints of printed board assemblies. The webinar demonstrates how current procedures and technologies are suitable for use in solder paste inspection, but not completely adequate for inspection of printed circuit board assemblies. In particular, the shadow effects of high components and the high density of assemblies limit the use of the well-known triangulation technology for this application.