Key elements of current & future Application Specific Standard Product (ASSP) designs include large, fast memory, (multi-) core processors, wired and/or wireless networking, high-speed communication interfaces, graphical control and display features, as well as sensors and actors (MEMS). All of these elements require advanced test techniques, if for no other reasons than diminishing test access:
GOEPEL presents a number of test techniques under the umbrella of Embedded System Access (ESA) technologies at this year’s International Test Conference (ITC) in Anaheim, CA. Visit us at booth #219 to learn more about technologies for high-speed memory test, high-speed in-system programming, FPGA assisted testing, processor emulation test, and embedded real-time diagnostics.
This short video shows RAPIDO in action: high-speed programming on up to 32 boards in parallel. For more details, visit http://www.goepelusa.com/model/rapido/.
This video has been recorded at electronica 2014 in Munich, Germany, demonstrating high-speed in-system programming and boundary-scan testing of ten boards in parallel. In actual use, RAPIDO would be used in-line in the manufacturing environment.
Details and product brief can be found on GOEPEL’s website. Or, simply send us your inquiry.
CION LX module FXT96
At International Test Conference (ITC) 2014 in Seattle, GOEPEL Electronics introduced the CION-LX Module/FXT96, a new mixed-signal JTAG I/O module enabling boundary-scan based tests to non scannable circuit components such as connectors, clusters, or analog interfaces.
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Watch this short video to get a brief overview of some of the SCANVISION tools and features available in GOEPEL’s CASCON GALAXY software. SCANVISION is a software tool for the visualization of layout and schematic files for printed circuit board assemblies, tightly integrated in the JTAG / boundary-scan software environment CASCON GALAXY.
To learn more about SCANVISION or other tools in CASCON GALAXY, please visit www.goepelusa.com or contact us.
New and innovative 3D-AOI from GOEPEL electronic
This webinar recording discusses the latest developments in the field of 3D AOI measurement of components and solder joints of printed board assemblies. The webinar demonstrates how current procedures and technologies are suitable for use in solder paste inspection, but not completely adequate for inspection of printed circuit board assemblies. In particular, the shadow effects of high components and the high density of assemblies limit the use of the well-known triangulation technology for this application.