Is IPC-610 sufficient for through-hole inspection?

“IPC-A-610, Acceptability of Electronic Assemblies is the most widely used standard published by the IPC.” (http://www.ipc.org/ContentPage.aspx?pageid=IPC-A-610)

The “holy book” of PCB manufacturing still lacks the appendix for Automated Optical Inspection (AOI) and Automated X-Ray Inspection (AXI) machines. Though it does regulate limits and rules for the manufacturing, it does not give actual guidelines for the programming of inspection systems. AOI/AXI programmers across the world have worked around this issue by working closely with production and quality engineers to ensure the IPC-610 rules find their way into the automated inspection process. This process is of course not perfect and depends on the experience of the persons involved. Read the rest of this entry »

AXI + AOI = AXOI, a formula for 100% optical inspection

This webinar recording discusses the use of a combined X-ray and AOI approach for IPC compliant inspection of solder joints on electronic assemblies. The webinar shows why X-ray inspection should be used for testing of all solder joints of an assembly, and not only for partially concealed solder joints. Furthermore, possibilities and limits of error detection will be shown by many image examples.

 

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New software module topoVIEW facilitates enhanced evaluation of X-Ray images

TopoView Example image; click to enlarge

TopoView Example; click to enlarge

As an essential component of the latest version v3.1 of its X-ray inspection software XI-Pilot, GOEPEL introduces a new module for easier evaluation of x-ray images. The innovative new feature, topoVIEW™, facilitates the interpretation of recorded x-ray images with respect to better fault assessment and classification. Read the rest of this entry »

Automated 3D X-Ray Inspection of Double-Sided PCBAs

An article titled “3D X-Ray Inspection Provides Quality Check of Double-Sided PCBs” by GOEPEL’s Andreas Tuerk, published in he March 2013 issue of US Tech, briefly explains how 3D X-Ray Inspection enables superior quality checks of double-sided printed circuit board assemblies (PCBAs).

Specific topics discussed in the article include digital tomosynthesis, component libraries, and PCB warping.

Download the article to read more, or visit our website for more information about automated x-ray inspection.

OptiCon X-Line 3D Inline X-Ray Inspection System available for evaluation in the US

The new X-Ray inspection system “OptiCon x-Line 3D” is now available for benchmarks and evaluations in the US.

After the successful launch and presentation at APEX 2012 in San Diego, CA, the system is now being hosted by DATEST in Fremont, CA.

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