Is IPC-610 sufficient for through-hole inspection?

“IPC-A-610, Acceptability of Electronic Assemblies is the most widely used standard published by the IPC.” (http://www.ipc.org/ContentPage.aspx?pageid=IPC-A-610)

The “holy book” of PCB manufacturing still lacks the appendix for Automated Optical Inspection (AOI) and Automated X-Ray Inspection (AXI) machines. Though it does regulate limits and rules for the manufacturing, it does not give actual guidelines for the programming of inspection systems. AOI/AXI programmers across the world have worked around this issue by working closely with production and quality engineers to ensure the IPC-610 rules find their way into the automated inspection process. This process is of course not perfect and depends on the experience of the persons involved. Read the rest of this entry »

Impact of various illumination concepts on fault detection in optical inspection systems

Impact of various illumination concepts on fault detection in optical inspection systems

In the past, automated optical inspection systems (AOI) focused on increasing inspection speed along with the number of cameras and megapixels.  For a successful AOI process, however, false call rate and safe fault detection is as important as the overall inspection speed. Highly sophisticated optical inspection systems are equipped with various illumination modules. Fault detection and false calls reduction depends on the right selection of light-frequency, -angle and -intensity, not just  cameras and algorithms used.

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GOEPEL and SiliconAid join forces to provide Chip Level Debug in Board and System Environments

GOEPEL Electronics announces joint developments with SiliconAid Solutions in the area of chip level debug in board and system environments. GOEPEL and SiliconAid personnel were present at ITC in Anaheim, CA, last week to discuss details of these developments and the benefits of leveraging both technologies together.

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GOEPEL accelerates graphical Boundary Scan Project Development for Multi Board Designs

In cooperation with ASTER TechnologiesGOEPEL electronic has developed a new version of its ScanVision tool suite to solve the problem of multi-board design visualization at the layout and schematic level, enabling a significantly improved level of productivity in project development as well as fault analysis on the production stage.

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Time to play

Though Microsoft’s Kinect for the Xbox is the first consumer product which uses the fringe detection principle, it was and still is a method commonly used to measure and analyze 3D objects and surfaces. Typical applications include the classification of grinding tools, quality control for engine parts (automotive, aerospace, defense), planarity measurements,  reverse engineering, and – of course – solder paste inspection in the PCB manufacturing process.

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