Innovative multi-camera image acquisition for THT and conformal coat inspection

MultiCam Line is a high-speed automated optical inspection (AOI) system for through-hole technology (THT) component and conformal coat inspection, based on the innovative multi camera image acquisition module MultiEyeS. Watch this short (6 min 30 sec) video to get an overview of the system specification and use cases.

Test Strategy for IoT Devices receives Embedded World 2016 Award

embedded Award 2016At Embedded World 2016 in Nuremberg, JEDOS (GOEPEL’s test and diagnostics tool for electronic assemblies) received the embedded Award 2016 in the tools category.

With the Embedded Award, a high-ranking jury with representatives from science research, industry, and media recognizes innovative products and solutions that advance the industry of embedded systems and the IoT (Internet of Things) in outstanding ways. GOEPEL receives Embedded Award 2016
The award ceremony took place at the official press conference by Prof. Matthias Sturm, Chairman of the Advisory Board of the embedded world, and Dr. Roland Fleck, Managing Director of NürnbergMesse on the first day of Embedded World.

“We are proud of the high recognition our JEDOS test and diagnostic tool enjoys. Winning this award shows us that with our integrated technology platform we’re on the right track”, says Thomas Wenzel, Managing Director of the JTAG/Boundary Scan division of GOEPEL electronic, after accepting the award. JEDOS awarded at Embedded World 2016“By integrating embedded diagnostics test and JTAG/boundary scan, we are addressing the latest test challenges posed by complex electronic designs, such as Internet of Things components.”

First introduced in 2015, JEDOS is a platform for high-quality embedded tests of complex electronic design. JEDOS offers a variety of functions for test, validation, calibration, and device programming. Using the native processor, diagnostic functional tests can be performed in real time. A key advantage of JEDOS is the possibility to fully test IoT components without the use of firmware. By integrating of boundary scan and functional embedded test and diagnostics, dependable test and fault coverage can be achieved. As a result, firmware and software engineers can benefit from pre-verified prototype hardware, making their development and debug work more efficient.

To learn more about JEDOS, please view this webinar or contact GOEPEL.

Everything you need to know about embedded real-time functional test

Can you imagine an embedded diagnostic operating system suitable for use in lab and production; capable of performing both at-speed / real-time diagnostic functional tests and high-speed in-system flash programming?

Intrigued? Attend our upcoming webinar on January 26th, at 11 AM EST, 8 AM PST (16:00 UTC).

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Is IPC-610 sufficient for through-hole inspection?

“IPC-A-610, Acceptability of Electronic Assemblies is the most widely used standard published by the IPC.” (

The “holy book” of PCB manufacturing still lacks the appendix for Automated Optical Inspection (AOI) and Automated X-Ray Inspection (AXI) machines. Though it does regulate limits and rules for the manufacturing, it does not give actual guidelines for the programming of inspection systems. AOI/AXI programmers across the world have worked around this issue by working closely with production and quality engineers to ensure the IPC-610 rules find their way into the automated inspection process. This process is of course not perfect and depends on the experience of the persons involved. Read the rest of this entry »

Test Optimization in Production through the Use of Boundary Scan

View our latest webinar recording on “Test Optimization in Production – Reduction of Test Time through the Use of Boundary Scan” to learn how you can reduce test time and complex interface hardware through the use of JTAG/Boundary Scan. While Boundary Scan as a test methodology has been around for more than 25 years, its advantages for production test often are still underestimated.
And, over the years this technology has seen a lot of innovation.

Designers and test planners alike are confronted with the same problem: to ensure sufficient test access despite increasing miniaturization and simultaneous increase in functionality and complexity of modern electronics.
“Every circuit node needs a test point!” Many of you have heard this statement. But this is no longer possible on modern electronics. Join us in this webinar to learn about powerful and cost saving methods to utilize boundary-scan and related technologies in manufacturing test.

Topics that will be addressed during the webinar:

  • “JTAG / Boundary Scan” nowadays is much more than just connectivity test.
  • Utilize the UUT’s FPGA or microprocessor as an embedded test system.
  • Testing that previously required high numbers of test probes can still be done when physical external access is no longer possible.


Target audience:  Test engineers, test managers, production engineers, production managers, CEOs, contract designers and contract manufacturers, design engineers and design managers.


Level:  Beginners and advanced users.


This webinar was originally presented on November 3, 2015.

Feel free to view the webinar recording by following this link