At this year’s SMT/Hybrid/Packaging tradeshow in Nuremberg/Germany, GOEPEL electronic GmbH presented a wide range of innovations in its AOI systems, AXI systems, and in the company’s JTAG/boundary-scan product line.
Ever wish you had an inline system dedicated to multi-site high speed On-Board Programming of non-volatile memories like Flash, Microcontrollers and PLDs? Goepel Electronics has developed just such a system!
Based on advanced integrated In-System Programming technologies it addresses not just the problems of continuously increasing memory size, but also offers a true alternative to the traditional Device Programmers due to its excellent flexibility. The patented mechanics with exchangeable Cassettes enables combinations of Programming and Test with safe and precise contact from both sides of the UUT even with high nail counts. Goepel’s award winning, industry proven SCANFLEX hardware platform is at the core of the system, assuring future dependability and flexibility.
Key Features:
…or “Let there be light” for those who prefer English (or missed the Latin class in school).
The heart of an Optical Inspection System is obviously the camera, but without the proper lighting and the resulting reflections even the best camera won’t allow a dependable fault detection. Especially with today’s challenges, like the use of 01005 packages or the switch to lead-free soldering, the good old days of a simple top illumination with white light in combination with a 1 Megapixel camera are definitely over.
GOEPEL Electronics has introduced ChipVORX® Module™, a special FPGA based I/O module product line. The new modules are controlled via a standard TAP enabling access to the entire ChipVORX® eco system of test and programming IPs for external instrumentation.
In recent years the trend to more densely packed printed circuit board assemblies (PCBAs) with fewer test points or other opportunities for physical access to signals critical for sufficient test coverage has really taken off. The wide use of ball grid array packaging and signal traces that never surface at the PCBA’s top or bottom side are two examples of design features that impact the availability of test access points. This will continue to be problematic and likely get worse. But - embedded system access (ESA) is coming to the rescue. JTAG / boundary scan is one technology that can help regain some of the test access that physical probe based test methodologies are loosing. In addition, the test access port (TAP) interface defined in IEEE Std 1149.1 can be utilized not only for boundary-scan testing but also to access other device internal test and debug capabilities, further enhancing the testability and fault coverage achievable with embedded system access. The diagram on the left illustrates this trend (click on the thumbnail to enlarge the diagram).
Contact us to learn more about embedded system access and to request a white paper on ESA strategies .
At IPC APEX 2012, we demonstrated version 4.6 of our Boundary Scan software platform SYSTEM CASCON™. With this version we are introducing the concept of Embedded System Access (ESA) technologies.
Embedded System Access stands in contrast to intrusive board access (IBA) techniques, such as bed-of-nail or flying-probe based in-circuit test, and native connector access, as commonly applied for functional test. Yet, ESA and these other access techniques do not necessarily have to be used exclusively, but rather can be combined in integrated test solutions.
This year’s IPC APEX conference can exhibition took place in San Diego, CA. While it seemed unusually cold in San Diego (could be just me having been used to warmer temperatures in Austin, TX) the tradeshow itself was successful for GOEPEL Electronics. This year we had a larger size booth and showcased both AOI and AXI systems in addition to our boundary scan products. Patrick Schuchardt of our Application Support team presented a paper on void inspection with X-Ray systems (download a copy of the poster related to the paper he presented).
GOEPEL Electronics will be present again at this year’s IPC APEX in San Diego. If you intend to attend the tradeshow, please be sure to visit us at booth # 2450 to learn about our latest JTAG / boundary scan and industry leading AOI / AXI and THT inspection solutions.
On January 31, 2012, UBM hosted the annual Test & Measurement World “Best in Test” award ceremony in Santa Clara, CA. GOEPEL Electronics was represented with “Best in Test” finalists in two categories.
Test Coach Corporation, a member of GOEPEL electronic’s GATE program, hosts a “Boundary Scan and Flying Probe Test Seminar” on February 7th, 2012, in Lake Zurich, Illinois. Read the rest of this entry »